Conductive molding composition

Details Conductive molding composition Conductive molding composition

1980-07-28

1983-03-29

Barr, J. L.

Compositions

Electrically conductive or emissive compositions

Elemental carbon containing

252500, 358342, 358344, 523174, 524495, 369126, 369276, H01B 106

Patent

active

043783104

ABSTRACT:
An improved molding composition having a high thermal stability, including a vinyl chloride/vinyl acetate copolymer-based resin, sufficient finely divided conductive particles to obtain the desired conductivity, and from 3 to 20 weight percent of the modifying additive BLENDEX 586, which is a three-component blend of polyvinyl chloride, a graft copolymer of acrylonitrile, styrene and polybutadiene, and a copolymer of alpha-methyl styrene and acrylonitrile, as described in U.S. Pat. No. 3,053,800. High density information discs fabricated from this molding composition have improved dimensional stability and increased resistance to environmental temperature changes.

REFERENCES:
patent: 3053800 (1962-09-01), Grabowski et al.
patent: 3481893 (1969-12-01), Pungs et al.
patent: 3842194 (1975-10-01), Clemens
patent: 3842217 (1974-10-01), Clemens
patent: 3909517 (1975-09-01), Clemens
patent: 3960790 (1976-06-01), Khanna
patent: 4151132 (1979-04-01), Khanna

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