Coating processes – Electrical product produced – Metal coating
Patent
1988-06-06
1991-03-05
Beck, Shrive
Coating processes
Electrical product produced
Metal coating
427337, 427367, 427371, 427370, 4273831, C23C 2400
Patent
active
049976745
ABSTRACT:
A conductive metal layer is formed on a substrate by depositing copper or nickel particles on the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The coated substrates have conductive surfaces and are useful for a variety of uses such as EMI shielding and printed circuit boards.
REFERENCES:
patent: 3596842 (1986-06-01), Chung
patent: 4064074 (1977-12-01), Ellis
patent: 4232060 (1980-11-01), Mallory
patent: 4382981 (1983-05-01), Stoetzer et al.
patent: 4508640 (1985-04-01), Kanda
patent: 4572843 (1986-02-01), Saito
patent: 4590115 (1986-05-01), Cassat
patent: 4614837 (1986-09-01), Kane
patent: 4663240 (1987-05-01), Hajdu
patent: 4681712 (1987-07-01), Sakakibara
patent: 4786570 (1988-11-01), Yu
patent: 4795660 (1989-01-01), Cooray
patent: 4799996 (1989-01-01), Cassat
Derwent Abstract 84-176031, Matveeva, 11/07/83.
Frank Dieter
Hutton Ronald E.
Moy Paul Y. Y.
Parr William J. E.
Strawser David A.
Akzo America Inc.
Beck Shrive
Dang Vi Duong
Morris Louis A.
LandOfFree
Conductive metallization of substrates via developing agents does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Conductive metallization of substrates via developing agents, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive metallization of substrates via developing agents will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-495607