Conductive metallization of substances without developing agents

Details Conductive metallization of substances without developing agents Conductive metallization of substances without developing agents

1989-11-16

1991-10-22

Beck, Shrive

Stock material or miscellaneous articles

Composite

Of metal

427369, 427370, 427123, 427180, 427192, C23C 2400

Patent

active

050594850

ABSTRACT:
A conductive metal layer is formed on a substrate having a softening point above about 200.degree. C. by depositing copper and nickel particles having a substantially continuous oxide coating thereon on the substrate, and heating and pressing the metal particles at a temperature of at least 200.degree. C. Unlike similar methods wherein oxide coated metal particles are used, no developing agent is required to render the metal layer conductive. The coated substrates are useful for a variety of uses such as EMI shielding and printed circuit boards.

REFERENCES:
patent: 4382981 (1983-05-01), Stoetzer
patent: 4572843 (1986-02-01), Saito
patent: 4614837 (1986-09-01), Kane
patent: 4663240 (1987-05-01), Hajdu
patent: 4795660 (1989-01-01), Cooray

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