Compositions – Electrically conductive or emissive compositions – Free metal containing
Patent
1988-06-08
1990-10-09
Barr, Josephine
Compositions
Electrically conductive or emissive compositions
Free metal containing
252513, 419 10, 419 31, 419 34, 419 57, H01B 106
Patent
active
049618792
ABSTRACT:
A conductive metal-filled substrate is formed by intermingling copper or nickel particles into the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The filled substrates are electrically conductive and are useful for a variety of uses such as EMI shielding.
Frank Dieter
Hutton Ronald E.
Moy Paul Y. Y.
Parr William J. E.
Akzo America Inc.
Barr Josephine
Morris Louis A.
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