Conductive metal ball bonding with electrostatic discharge...

Details Conductive metal ball bonding with electrostatic discharge... Conductive metal ball bonding with electrostatic discharge...

2011-01-24

2011-11-29

Stoner, Kiley (Department: 1735)

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

C228S008000, C228S103000, C228S180500

Reexamination Certificate

active

08066171

ABSTRACT:
An apparatus for bonding a conductive lead to a conductive terminal of a device by the use of a conductive metal ball is disclosed. A ball-forming wire comprises a first conductive metal having a first melting temperature. A clamping surface has a closed position in contact with the ball-forming wire. A wire-clamping actuator is coupled to the clamping surface and is electrically connected to a clamping signal source. A sparking pin comprises a second conductive metal having a second melting temperature higher than the first melting temperature. The sparking pin is electrically connected to a power source. A current detection transformer includes a magnetic core at least partially encircling the ball-forming wire. An analyzing circuit is electrically connected to the current detection transformer.

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Office Action dated Sep. 17, 2010 from U.S. Appl. No. 11/770,328, 5 pages.
Notice of Allowance dated Oct. 21, 2010 from U.S. Appl. No. 11/770,328, 15 pages.

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