Conductive metal ball attaching apparatus and method, and bump f

Details Conductive metal ball attaching apparatus and method, and bump f Conductive metal ball attaching apparatus and method, and bump f

1995-11-27

1997-02-11

Heinrich, Samuel M.

Textiles: manufacturing

228254, 228 41, 437183, 221211, H01L 2160, B23K 100, B23K 300

Patent

active

056012292

ABSTRACT:
In a solder ball attaching apparatus, a pickup head is lowered and raised just above a solder ball feed section so as to pick up a large number of solder balls. The pickup head then moves to a position just above a flux feed section where the pickup head is lowered and raised so as to flux the solder balls. Further, the pickup head moves to a position just above a workpiece where the pickup head is lowered and raised so as to attach the solder balls onto electrodes of the workpiece. Alongside a transfer path of the pickup head are arranged first and second line light sources, a light-emitting element and a light-receiving element for monitoring presence or absence of a solder ball pickup error, dislodging of the solder ball and a solder ball attaching error.

REFERENCES:
patent: 5088639 (1992-02-01), Gondotra et al.
patent: 5284287 (1994-02-01), Wilson et al.
patent: 5445313 (1995-08-01), Boyd et al.
patent: 5467913 (1995-11-01), Namekawa et al.
patent: 5540377 (1996-07-01), Ito

Affiliated with

Also associated with

Rating

Conductive metal ball attaching apparatus and method, and bump f does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Conductive metal ball attaching apparatus and method, and bump f, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive metal ball attaching apparatus and method, and bump f will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-336241