Semiconductor device manufacturing: process – Having magnetic or ferroelectric component
Reexamination Certificate
2007-03-06
2007-03-06
Wilczewski, Mary (Department: 2822)
Semiconductor device manufacturing: process
Having magnetic or ferroelectric component
C438S238000, C438S382000, C438S385000, C438S785000
Reexamination Certificate
active
10605977
ABSTRACT:
A conductive memory stack is provided. The memory stack includes a bottom electrode, a top electrode and a multi-resistive state element. The multi-resistive state element is sandwiched between the electrodes such that the top face of the bottom electrode is in contact with the multi-resistive state element's bottom face and the bottom face of the top electrode is in contact with the multi-resistive state element's top face. The bottom electrode, the top electrode and the multi-resistive state element all have sides that are adjacent to their faces. Furthermore, the sides are at least partially covered by a sidewall layer.
REFERENCES:
patent: 5280013 (1994-01-01), Newman et al.
patent: 6204139 (2001-03-01), Liu et al.
patent: 6249014 (2001-06-01), Bailey
patent: 6456525 (2002-09-01), Perner et al.
patent: 6569745 (2003-05-01), Hsu
patent: 6856536 (2005-02-01), Rinerson et al.
patent: 6927430 (2005-08-01), Hsu
patent: 2003/0001178 (2003-01-01), Hsu et al.
patent: 2004/0036065 (2004-02-01), Doan et al.
patent: 2005/0158994 (2005-07-01), Zhuang et al.
Wolf, Ph.D.., Stanley, Richard N. Tauber, Ph.D., “Aluminum Thin Films and Physical Vapor Deposition in VLSI,” Silicon Processing for the VLSI Era—vol. 1: Process Technology, Lattice Press, 1986, pp. 335, 367.
Wolf, Ph.D., Stanley, “Contact Technology and Local Interconnects for VLSI,” Silicon Processing for the VLSI Era—vol. 2: Process Integration, Lattice Press, 1986, pp. 121-123.
Beck, A. et al., “Reproducible switching effect in thin oxide films for memory applications,” Applied Physics Letters, vol. 77, No. 1, Jul. 3, 2000, 139-141.
Liu, S.Q., et al., “Electric-pulse-induced reversible resistance change effect in magnetoresistive films”, Applied Physics Letters, vol. 76, No. 19, May 8, 2000, 2749-2651.
Liu, S.Q., et al., “A New Concept For Non-Volatile Memory: Electric-Pulse Induced Reversible Resistance Change Effect In Magnetoresistive Films”, Space Vacuum Epitaxy Center, University of Huston, Huston TX, 7 Pages.
Park, In Seon et al.,“Ultra-thin EBL(encapsulated barrier layer)for Ferroelectric Capacitor,” IDEM, vol. 97, 617-620.
Rossel, C. et al., “Electrical current distribution across a metal-insulator-metal structure during bistable switching,” Journal of Applied Physics, vol. 90, No. 6, Sep. 15, 2001, 2892-2898.
Watanabe, Y. et al., “Current-driven insulator-conductor transition and nonvolatile memory in chromium-doped SrTiO3single crystals,” Applied Physics Letters, vol. 78, No. 23, Jun. 4, 2001, 3738-3740.
Yoon, Dong-Soon et al., “High Performance of Novel Oxygen Diffusion Barrier Materials for Future High-Density Dynamic Random Access Memory Devices,” IEEE Transactions on Electron Devices, vol. 49, No. 11, Nov. 2002, 1917-1927.
Chevallier Christophe
Hsia Steve Kuo-Ren
Kinney Wayne
Longcor Steven W.
Rinerson Darrell
Thomas Toniae M.
Unity Semiconductor Corporation
Wilczewski Mary
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