Conductive materials based on encapsulated conductive polymers

Details Conductive materials based on encapsulated conductive polymers Conductive materials based on encapsulated conductive polymers

1994-12-09

1996-06-04

Therkorn, Linda Skaling

Compositions

Electrically conductive or emissive compositions

252351, 252357, 252518, 523201, 523332, 523352, 428407, H01B 100

Patent

active

055230210

ABSTRACT:
This invention concerns conductive materials based on an encapsulated conductive polymer. Encapsulation in a shell of polymer stabilizes the conductivity of these materials, which can be encapsulated in a shell of film-generating polymer, to give the material formed very good mechanical properties, unlike conductive polymers which existed in the prior art, which, if not encapsulated, form brittle materials that are less stable in time.

REFERENCES:
patent: 4481132 (1984-11-01), Dubois et al.
patent: 4508639 (1985-04-01), Camps et al.
patent: 4526706 (1985-07-01), Upson et al.
patent: 4661576 (1987-04-01), Derobert et al.
patent: 4699804 (1987-10-01), Miyata et al.
patent: 4894263 (1990-01-01), Dubois et al.
patent: 5143636 (1992-09-01), Gaucher

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