Conductive material for integrated circuit fabrication

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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C324S1540PB, C324S757020

Reexamination Certificate

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06870380

ABSTRACT:
A conductive composition of titanium boronitride (TiBxNy) is disclosed for use as a conductive material. The titanium boronitride is used as conductive material in the testing and fabrication of integrated circuits. For example, the titanium boronitride is used to construct contact pads such as inline pads, backend pads, sensors or probes. Advantages of embodiments of the titanium boronitride include reduced scratching, increased hardness, finer granularity, thermal stability, good adhesion, and low bulk resistivity. Exemplary methods of creating the titanium boronitride include a sputtering process and a plasma anneal process.

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Baker, et al. “Combined X-Ray Photoelectron/auger Electron Spectroscopy/Glaning Angle X-Ray diffraction/Extended X-Ray Absorbtion Fine Structure Investigation of TiBxNy Coatings”. J. Vac. Sci. Technol., A 15(2), pp. 284-291, Mar./Apr. 1997.
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