Conductive material for connecting part and method for...

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...

Reexamination Certificate

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C428S648000, C428S675000, C428S929000, C439S887000, C439S886000

Reexamination Certificate

active

07820303

ABSTRACT:
There is provided a conductive material comprising a base material made up of a Cu strip, a Cu—Sn alloy covering layer formed over a surface of the base material, containing Cu in a range of 20 to 70 at.%, and having an average thickness in a range of 0.1 to 3.0 μm and an Sn covering layer formed over the Cu—Sn alloy covering layer having an average thickness in a range of 0.2 to 5.0 μm, disposed in that order, such that portions of the Cu—Sn alloy covering layer are exposed the surface of the Sn covering layer, and a ratio of an exposed area of the Cu—Sn alloy covering layer to the surface of the Sn covering layer is in a range of 3 to 75%.

REFERENCES:
patent: 5780172 (1998-07-01), Fister et al.
patent: 6040067 (2000-03-01), Sugawara et al.
patent: 6312762 (2001-11-01), Sugawara et al.
patent: 6336979 (2002-01-01), Sugawara et al.
patent: 6770383 (2004-08-01), Tanaka et al.
patent: 7700883 (2010-04-01), Masago et al.
patent: 2003/0091855 (2003-05-01), Tanaka et al.
patent: 2003/0129441 (2003-07-01), Hara et al.
patent: 2003/0186597 (2003-10-01), Suzuki et al.
patent: 2004/0265618 (2004-12-01), Tsuji et al.
patent: 2007/0218312 (2007-09-01), Sakuyama et al.
patent: 2008/0188100 (2008-08-01), Saitoh
patent: 2008/0257581 (2008-10-01), Masago et al.
patent: 2009/0053553 (2009-02-01), Masago et al.
patent: 2009/0061253 (2009-03-01), Yoshida et al.
patent: 2010/0047112 (2010-02-01), Fugono et al.
patent: 11-140569 (1999-05-01), None
patent: 2004-68026 (2004-03-01), None
patent: 1 024 212 (2000-08-01), None
patent: 1 026 287 (2000-08-01), None
patent: 2 381 963 (2003-05-01), None
patent: 10 60666 (1998-03-01), None
patent: 11 135226 (1999-05-01), None
patent: 11-233228 (1999-08-01), None
patent: 2000-021545 (2000-01-01), None
patent: 2002 226982 (2002-08-01), None
patent: 2002 298963 (2002-10-01), None
patent: 2004 232014 (2004-08-01), None
patent: 2005-154819 (2005-06-01), None
patent: WO 03/028159 (2003-04-01), None
English machine translation of JP 2004-068026. Mar. 2004.
English machine translation of JP 11-135226. May 1999.

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