Conductive material for a connecting part

Details Conductive material for a connecting part Conductive material for a connecting part

2011-01-18

2011-01-18

McNeil, Jennifer C (Department: 1784)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

C428S648000, C428S675000, C428S929000, C439S887000, C439S886000

Reexamination Certificate

active

07871710

ABSTRACT:
Disclosed is a conductive material for a connecting part, including: a base material made up of a Cu strip; a Cu—Sn alloy covering layer having an average thickness of 0.2 to 3.0 μm; and an Sn covering layer, the Cu—Sn alloy covering layer being provided between the base material and the Sn covering layer, wherein in a cross section perpendicular to the surface of the conductive material, the diameter [D1]of the minimum inscribed circle of the Sn covering layer is 0.2 μm or less, the diameter [D2]of the maximum inscribed circle of the Sn covering layer is 1.2 to 20 μm, the difference in elevation [y] between the outermost point of the material and the outermost point of the Cu—Sn alloy covering layer is 0.2 μm or less, and a bright or semi-bright tin electroplating layer having an average thickness of 0.01 μm or more in an approximately uniform thickness is formed on the outermost layer as part of the Sn covering layer.

REFERENCES:
patent: 6551931 (2003-04-01), Edelstein et al.
patent: 6759142 (2004-07-01), Hara et al.
patent: 6784088 (2004-08-01), Edelstein et al.
patent: 2003/0091855 (2003-05-01), Tanaka et al.
patent: 2004/0212089 (2004-10-01), Edelstein et al.
patent: 2005/0037229 (2005-02-01), Tanaka
patent: 2008/0090096 (2008-04-01), Suzuki et al.
patent: 2008/0257581 (2008-10-01), Masago et al.
patent: 1455829 (2003-11-01), None
patent: 1985333 (2007-06-01), None
patent: 2 381 963 (2003-05-01), None
patent: 10-60666 (1998-03-01), None
patent: 11-135226 (1999-05-01), None
patent: 2002-226982 (2002-08-01), None
patent: 2002-298963 (2002-10-01), None
patent: 2003-151668 (2003-05-01), None
patent: 2004-68026 (2004-03-01), None
patent: 2006-77307 (2006-03-01), None
patent: 2006-183068 (2006-07-01), None
U.S. Appl. No. 12/523,070, filed Jul. 14, 2009, Fugono, et al.
U.S. Appl. No. 12/712,494, filed Feb. 25, 2010, Taira, et al.

Affiliated with

Also associated with

Rating

Conductive material for a connecting part does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Conductive material for a connecting part, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive material for a connecting part will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2692525