Conductive material and method for filling via-hole

Details Conductive material and method for filling via-hole Conductive material and method for filling via-hole

2005-05-03

2005-05-03

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S854000, C427S097700

Reexamination Certificate

active

06886248

ABSTRACT:
The conductive material comprises a first metal material having a melting point of not more than 250° C. and a second metal material having a melting point of not less than 500° C., and is paste at a temperature not more than 250° C. Whereby the conductive material can have much higher conductivity than the resin paste. The conductive material can be used in paste, whereby the conductive material can be buried in the via-hole in the same way as the resin paste.

REFERENCES:
patent: 4544577 (1985-10-01), May
patent: 5029242 (1991-07-01), Sammet
patent: 5262718 (1993-11-01), Svendsen et al.
patent: 5287620 (1994-02-01), Suzuki et al.
patent: 5370759 (1994-12-01), Hakotani et al.
patent: 5630272 (1997-05-01), Wenke
patent: 5716663 (1998-02-01), Capote et al.

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