Conductive lead arrangement

Details Conductive lead arrangement Conductive lead arrangement

1987-08-19

1988-10-25

Weidenfeld, Gil

Electrical connectors

Metallic connector or contact having part permanently...

Adapted to be secured to conductor formed on printed circuit...

439 65, 439933, H01R 402, H01R 909

Patent

active

047800984

ABSTRACT:
A conductive lead for connection to a first conductive area of a device having two opposed surfaces with a conductive area comprises an elongated conductive body formed from a substantially flat strip of a resilient material. The conductive body has a pair of opposite arms adapted to engage the opposed device surfaces resiliently. A non-conductive element is held by one arm and is adapted to engage the other surface of the device to insulate the lead from the other surface. The conductive area of the other surface is insulated by the lead and the non-conductive element from the conductive area of the first surface.

REFERENCES:
patent: 4433892 (1984-02-01), Seidler

Affiliated with

Also associated with

Rating

Conductive lead arrangement does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Conductive lead arrangement, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive lead arrangement will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2267218