Electricity: conductors and insulators – Anti-inductive structures – Conductor transposition
Patent
1996-07-11
1997-07-29
Ledynh, Bot L.
Electricity: conductors and insulators
Anti-inductive structures
Conductor transposition
361816, 361818, H05K 900
Patent
active
056524102
ABSTRACT:
A conductive insert for protecting an externally mounted microelectronic device is disclosed. The conductive insert is designed to prevent ESD (Electrostatic Discharge) or RFI (Radio Frequency Interference) destruction or inoperability of the microelectronic device. The conductive insert includes a first exterior surface and a second interior surface. The second interior surface has a conductor material applied thereon for providing ESD or RFI protection to the externally mounted electronic device. To protect the externally mounted microelectronic device, the conductive insert mounts within a mounting plate for covering the externally mounted electronic device. Instead of having a conductive material applied to the interior surface, the conductive insert may be manufactured from a conductive material initially. Additionally, electrically conductive finger springs can be formed in the conductive insert to provide electrical connection between the mounting plate and the microelectronic device or conductive product case.
REFERENCES:
patent: 4427114 (1984-01-01), Howell et al.
patent: 4557379 (1985-12-01), Lane et al.
patent: 4641223 (1987-02-01), McIntosh
patent: 4680676 (1987-07-01), Petratos et al.
patent: 4725918 (1988-02-01), Bakker
patent: 4791524 (1988-12-01), Teigen et al.
patent: 5012924 (1991-05-01), Murphy
patent: 5066240 (1991-11-01), Verdun
patent: 5102712 (1992-04-01), Peirce et al.
patent: 5150282 (1992-09-01), Tomura et al.
patent: 5167326 (1992-12-01), Murphy
patent: 5170318 (1992-12-01), Catala et al.
patent: 5214562 (1993-05-01), Levi
patent: 5241695 (1993-08-01), Roshitsh et al.
patent: 5294994 (1994-03-01), Robinson et al.
patent: 5374779 (1994-12-01), Konishi
patent: 5416668 (1995-05-01), Benzoni
Anti-Static Thermoformed Plastic Insert For Packaging Cartons Used For Shipping Electronic Card Assemblies, IBM Technical Disclosure Bulletin, vol. 28, No. 9, Feb., 1986, pp. 4077-4078.
Molding Of EMI and RFI Shielding Into Product Enclosures, IBM Technical Discloure Bulletin, vol. 27, No. 10B, Mar. 1985, p. 5971.
Hobbs Steven P.
Wheeler Stephen E.
International Business Machines - Corporation
Ledynh Bot L.
LandOfFree
Conductive insert for providing electromagnetic charge protectio does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Conductive insert for providing electromagnetic charge protectio, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive insert for providing electromagnetic charge protectio will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-635241