Conductive ink compositions

Details Conductive ink compositions Conductive ink compositions

2006-05-02

2006-05-02

Kopec, Mark (Department: 1751)

Compositions

Electrically conductive or emissive compositions

Free metal containing

C252S514000, C427S096100

Reexamination Certificate

active

07037447

ABSTRACT:
The present invention provides a thermoset conductive ink for use in through hole interconnections or similar electric and electronic applications to provide stable electrical connections. The conductive ink of this invention comprises a thermal curable resin system having an admixture of one or more maleimide, nadimide, or itaconimide containing resins, a comonomer and a catalyst, an electrically conductive material such as silver, copper or silver-coated copper, and optionally an organic solvent.

REFERENCES:
patent: 4552690 (1985-11-01), Ikeguchi et al.
patent: 4756756 (1988-07-01), Cassat
patent: 5789757 (1998-08-01), Husson, Jr. et al.
patent: 6034195 (2000-03-01), Dershem et al.
patent: 6187886 (2001-02-01), Husson, Jr. et al.
patent: 6322620 (2001-11-01), Xiao
patent: 6350841 (2002-02-01), Schultz et al.

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