Conductive ink composition and method of forming a conductive th

Details Conductive ink composition and method of forming a conductive th Conductive ink composition and method of forming a conductive th

1992-09-25

1994-11-22

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427428, 4273835, B05D 100

Patent

active

053667603

ABSTRACT:
A method of forming a conductive thick film pattern comprises the steps of filling grooves of an intaglio with a conductive ink, transferring the conductive ink in the grooves onto a blanket of which surface is coated with an elastic material, transferring and printing a conductive thick film pattern transferred on the blanket onto a substrate, firing the conductive pattern to scatter the organic matter, and sintering the conductive pattern. A conductive ink comprises conductive metal powder, glass frit, transition metal oxide, dispersing agent, and vehicle containing an organic binder comprising at least one of poly-iso-butyl methacrylate, poly-iso-propyl methacrylate, polymethyl methacrylate, poly-4-fluoroethylene, and poly-.alpha.-methyl styrene.

REFERENCES:
patent: 4508753 (1985-04-01), Stepan
patent: 4865772 (1989-09-01), Suehiro
patent: 4937016 (1990-06-01), Suehiro
patent: 5059450 (1991-10-01), Mellul
patent: 5174925 (1992-12-01), Fujii

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