Conductive ink composition and method of forming a conductive th

Compositions – Electrically conductive or emissive compositions – Free metal containing

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252518, 252519, H01B 106

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051749254

ABSTRACT:
A method of forming a conductive thick film pattern comprises the steps of filling grooves of an intaglio with a conductive ink, transferring the conductive ink in the grooves onto a blanket of which surface is coated with an elastic material, transferring and printing a conductive thick film pattern transferred on the blanket onto a substrate, firing the conductive pattern to scatter the organic matter, and sintering the conductive pattern. A conductive ink comprises conductive metal powder, glass frit, transition metal oxide, dispersing agent, the vehicle containing an organic binder comprising at least one of poly-iso-butyl methacrylate, poly-iso-propyl methacrylate, polymethyl methacrylate, poly-4-fluoroethylene, and poly.alpha.-methyl styrene.

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patent: 4877555 (1989-10-01), Yuhaku
patent: 4921623 (1990-05-01), Yamaguchi et al.
patent: 4937016 (1990-06-01), Suehiro et al.
patent: 4996005 (1991-02-01), Saito et al.
patent: 5035837 (1991-07-01), Saeki et al.
Advanced Hybrid Technology pp. 44-49 (1989).

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