Conductive housing and biasing system for microwave integrated c

Amplifiers – With semiconductor amplifying device – Including distributed parameter-type coupling

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330277, 333246, H03F 360

Patent

active

046314946

ABSTRACT:
A processing system for microwave signals including a conductive housing having a waveguide probe for the input, a coaxial output connection and a section for receiving a microwave integrated circuit therein. The section contains two high impedance recesses therein, each of which is spaced a quarter-wavelength at microwave frequencies from the input and output portions of the integrated circuit. The high impedance recesses, reflected to the input and output sections, provide low impedance coupling therebetween for microwave signals. A dielectric member is interposed between the ground plane of the integrated circuit and the conductive housing to provide dc isolation therebetween and enable a single polarity voltage supply to establish the bias and operating voltages for the microwave integrated circuit.

REFERENCES:
patent: 2812501 (1957-11-01), Sommers
patent: 4093925 (1978-06-01), Yokoyama
patent: 4129897 (1978-12-01), Telewski et al.
patent: 4276655 (1981-06-01), Kraemer et al.
patent: 4480240 (1984-10-01), Gould

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