Conductive heat transfer for electrical devices from the...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C165S080200, C165S080300, C165S185000, C361S704000, C361S708000, C361S715000, C361S690000

Reexamination Certificate

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07443685

ABSTRACT:
An apparatus for conductive heat transfer for electrical devices from the solder side of a circuit card assembly can significantly reduce the component temperature, thereby maintaining the electrical device below its thermal limit. The apparatus comprises a thermally conductive member mountable on an opposite face of a circuit board from a face of the circuit board on which an electrical component is mounted, the thermally conductive member operable to conduct heat generated by the electrical component away from the electrical component.

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patent: 5923084 (1999-07-01), Inoue et al.
patent: 6696643 (2004-02-01), Takano
patent: 6700195 (2004-03-01), Mandel
patent: 6816377 (2004-11-01), Itabashi et al.
patent: 6821816 (2004-11-01), Lawlyes
patent: 7023699 (2006-04-01), Glovatsky et al.
patent: 7031165 (2006-04-01), Itabashi et al.
patent: 7057891 (2006-06-01), Ito et al.
patent: 7180745 (2007-02-01), Mandel et al.

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