Conductive frame for receiving an electronic module

Details Conductive frame for receiving an electronic module Conductive frame for receiving an electronic module

2000-02-11

2002-02-26

Gaffin, Jeffrey (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S689000, C361S689000, C361S800000, C361S816000, C174S034000

Reexamination Certificate

active

06351394

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to conductive frames for receiving electronic modules and, more particularly, to conductive GBIC frames.
BACKGROUND OF THE INVENTION
GBIC (Gigabit Interface Converter) frames currently in use in which GBIC electronic modules are guided and positioned are made of rigid plastic material as disclosed in U.S. Pat. No. 5,767,999. Shielding members and a spring-biased metal closure member are mounted at the front entrance of the GBIC frames to prevent EMI from affecting the GBIC electronic modules and to contain the EMI. The plastic GBIC frames are satisfactory for the electronic modules of lower speed systems; however, as higher speed systems have developed, greater EMI shielding is required. Moreover, the GBIC plastic frames are not able to be reflowsoldered to a circuit board and they must be mounted on the circuit board after the connectors and other components are soldered to the circuit board. This increases the applied cost of the GBIC systems to customers.
SUMMARY OF THE INVENTION
An important feature of the present invention is a conductive GBIC frame that provides complete EMI shielding for high speed systems. Another important feature is that the conductive GBIC frames can be reflow-soldered onto a circuit board at the same time electrical connectors and other components are soldered thereto thereby substantially decreasing the cost of manufacture. A further important feature is that the conductive GBIC will pass the finger probe test required by Underwriters Laboratory (UL).
A GBIC frame according to the present invention comprises a conductive frame including an upper wall and side walls depending downwardly therefrom, board-mounting members at bottom ends of the side walls for disposition in holes in a circuit board onto which the conductive frame is to be mounted, the upper wall has an elongated opening adjacent a front end of the conductive frame, a closure door is positioned across the conductive frame through the elongated opening and is pivotally mounted to the side walls, and a spring member is mounted on the closure door and the conductive frame thereby biasing the closure door to a normally closed position.
A metal closure member is mounted over the elongated opening of the conductive frame after the closure door has been positioned within the conductive frame.
Shielding members are mounted on upper and lower members of the front end of the conductive frame.


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AMP is Taking Fibre Channel from . . . , Connecting at a Higher level.™.
AMP Catalog 889003, Issued 11-96, pp. 19-21.
FCI Electronics, Customer Drawing No. 84790, Sheets 1 & 2. Dated Nov. 17, 1998.
FCI Electronics, Customer Drawing No. 84791, Sheets 1-5, Dated Oct. 13, 1998.

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