Conductive fine particles, method for plating fine...

Stock material or miscellaneous articles – Coated or structually defined flake – particle – cell – strand,... – Particulate matter

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C428S570000

Reexamination Certificate

active

10343944

ABSTRACT:
This invention provides a conductive fine particle having an ability of relaxing the force applied to a circuit of a substrate or the like. A conductive fine particle, comprising a core fine particle made of resin with its surface covered with at least one metal layer, wherein the resin has a coefficient of linear expansion of from 3×10−5to 7×10−5(1/K).

REFERENCES:
patent: 4740657 (1988-04-01), Tsukagoshi et al.
patent: 5486941 (1996-01-01), Saiuchi et al.
patent: 5614320 (1997-03-01), Beane et al.
patent: 6344156 (2002-02-01), Yamada et al.
patent: 6352775 (2002-03-01), Sasaki et al.
patent: 0 242 025 (1987-02-01), None
patent: 61231066 (1986-10-01), None
patent: 6-77408 (1988-04-01), None
patent: 63231889 (1988-09-01), None
patent: 1-242782 (1989-09-01), None
patent: 4192212 (1992-07-01), None
patent: 5036306 (1993-02-01), None
patent: 6-503180 (1994-04-01), None
patent: 7068690 (1995-03-01), None
patent: 9-137289 (1997-05-01), None
patent: 9-198916 (1997-07-01), None
patent: 9185069 (1997-07-01), None
patent: 9204815 (1997-08-01), None
patent: 9306231 (1997-11-01), None
patent: 11124682 (1999-05-01), None
patent: 11-172495 (1999-06-01), None
patent: 11-265910 (1999-09-01), None
patent: 11256390 (1999-09-01), None
patent: 11-329059 (1999-11-01), None
patent: 11317416 (1999-11-01), None
patent: 2000133050 (2000-05-01), None
patent: WO 92/06402 (1992-04-01), None
Masaki Shinbo, Epoxy Resin Handbook, issued by Nikkan Kogyo Shinbun Ltd., Dec. 25, 1987; pp. 368-371.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Conductive fine particles, method for plating fine... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Conductive fine particles, method for plating fine..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive fine particles, method for plating fine... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3817317

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.