Conductive film structure, fabrication method thereof, and...

Details Conductive film structure, fabrication method thereof, and... Conductive film structure, fabrication method thereof, and...

2011-05-03

2011-05-03

Vu, David (Department: 2829)

Metal working

Method of mechanical manufacture

Electrical device making

C029S829000, C324S754030, C438S702000

Reexamination Certificate

active

07934314

ABSTRACT:
A method for forming a conductive film structure is provided, which includes providing a flexible insulating substrate, forming a conductive film overlying the flexible insulating substrate, patterning the conductive film to form a plurality of micro-wires overlying the flexible insulating substrate, wherein the micro-wires are extended substantially parallel to each other, forming an insulating layer overlying the flexible insulating substrate and the micro-wires, and winding or folding the flexible insulating substrate along an axis substantially parallel to an extending direction of the micro-wires to form a conducting lump.

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patent: 2005/0067293 (2005-03-01), Naito et al.
patent: 517320 (2003-01-01), None
patent: I280371 (2007-05-01), None

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