Compositions – Electrically conductive or emissive compositions – Free metal containing
Patent
1998-02-23
1999-04-06
Kopec, Mark
Compositions
Electrically conductive or emissive compositions
Free metal containing
524439, 528 93, H01B 122
Patent
active
058913670
ABSTRACT:
An electrically-conductive epoxy resin is disclosed having stable joint resistance over extended operating times and high impact strength where the resin is based on a silver flake-filled polymeric reaction product of a liquid bisphenol A having very low hydrolyzable chlorine content and suitable polypropylene oxide-based primary amine curing agents.
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Botter et al, "Factors That Influence the Electrical Contact Resistance of Isotropic Conductive Adhesive Joints During Climate Chamber Testing,"Proceedings -Adhesives in Electronics '96 Conference, Jun. 3-5, 1996, Stockholm, Sweden, pp. 30-37.
McCarthy, "New Test Methods for Evaluating Electrically Conductive Adhesives," J. Surface Mount Technology, vol. 9, pp. 19-26, Jul. 1996.
Zwolinski et al, "Electrically Conductive Adhesives for Surface Mount Solder Replacement," IEEE Transactions on Components, Packaging, and Manufacturing Technology --Part C, vol. 19, No. 4, pp. 241-250, Oct. 1996.
Liu, "When Can We Use Conductive Adhesives in Volume Production --An Overview of Advances of Conductive Adhesive Joining Technology in electronics Applications," Proceedings -International Seminar on Latest Achievements in Conductive Adhesive Joining in Electronics Packaging, Sep. 5, 1995, Norrkoping, Sweden.
Jagt, "Reliability of Electrically Conductive Adhesive Joints for Surface Mount Applications," PEP '97 -The First IEEE International Symposium on Electronics Packaging, Oct. 26-30, 1997, Norrkoping, Sweden.
Wong et al, "Fundamental Study of Electrically Conductive Adhesive (ECAs)," PEP '97 -The First IEEE International Symposium on Electronics Packaging, Oct. 26-30, 1997, Norrkoping, Sweden.
Basheer Rafil Abdulkadir
Zwolinski Michael Stephen
General Motors Corporation
Grove George A.
Kopec Mark
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