Conductive die attach tape

Details Conductive die attach tape Conductive die attach tape

1989-09-09

1992-10-27

Ryan, Patrick J.

Stock material or miscellaneous articles

Layer or component removable to expose adhesive

Halogen containing compound

428195, 428198, 428209, 428220, 428323, 428328, 428332, 428337, 428901, 428908, 206228, 206330, 156 60, 156233, B32B 900

Patent

active

051588188

ABSTRACT:
A conductive die attach tape is described which allows for mounting of diced semiconductor chips thereon, followed by removal of the chip with an adherent conductive adhesive, and the mounting of the chip/adhesive combination in a chip carrier preparatory to the wire bonding operation.

REFERENCES:
patent: 4687693 (1987-08-01), Sheyon et al.
patent: 4961804 (1990-10-01), Aurichio

Affiliated with

Also associated with

Rating

Conductive die attach tape does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Conductive die attach tape, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive die attach tape will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-904747