Conductive curable compositions

Compositions – Electrically conductive or emissive compositions

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C252S518100, C252S519520, C502S123000, C502S150000, C523S427000, C524S857000, C526S196000, C526S197000, C526S217000

Reexamination Certificate

active

07850870

ABSTRACT:
Conductive curable compositions contain a free radical polymerizable monomer, oligomer or polymer (i); an organoborane amine complex (ii), and an electrically or thermally conductive filler (iii). The conductive curable compositions can also contain an amine reactive compound having amine reactive groups (iv); and (v) a component capable of generating a gas when mixed with a compound bearing active hydrogen and a catalyst. The electrically conductive curable compositions can be used in composite articles of manufacture in which substrates are coated or bonded together with the composition and cured; and as electrically conductive rubbers, electrically conductive tapes, electrically conductive adhesives, electrically conductive foams, and electrically conductive pressure sensitive adhesives. The thermally conductive compositions can also be used in composite articles of manufacture in which substrates are coated or bonded together with the composition and cured, and as thermal interface materials, thermally conductive rubbers, thermally conductive tapes, thermally conductive adhesives, thermally conductive foams, thermally conductive seals and gaskets, and thermally conductive pressure sensitive adhesives.

REFERENCES:
patent: 2676182 (1954-04-01), Daudt et. al.
patent: 3231542 (1966-01-01), Elsinger et al.
patent: 3275611 (1966-09-01), Fields et al.
patent: 3855171 (1974-12-01), Wegehaupt et al.
patent: 4584355 (1986-04-01), Blizzard et al.
patent: 4585836 (1986-04-01), Homan et al.
patent: 4591622 (1986-05-01), Blizzard et al.
patent: 4690967 (1987-09-01), LaGarde et al.
patent: 4699966 (1987-10-01), Harris et al.
patent: 5310835 (1994-05-01), Skoultchi et al.
patent: 5380527 (1995-01-01), Legrow et al.
patent: 5536947 (1996-07-01), Klersy et al.
patent: 5539070 (1996-07-01), Zharov et al.
patent: 6121165 (2000-09-01), Mackey et al.
patent: 6169142 (2001-01-01), Nakano et al.
patent: 6361716 (2002-03-01), Kleyer et al.
patent: 6380301 (2002-04-01), Enami et al.
patent: 6403697 (2002-06-01), Mitsunaga et al.
patent: 6433057 (2002-08-01), Bhagwagar et al.
patent: 6489380 (2002-12-01), Zhou et al.
patent: 6521431 (2003-02-01), Kiser et al.
patent: 6534581 (2003-03-01), Kleyer et al.
patent: 6620515 (2003-09-01), Feng et al.
patent: 6699929 (2004-03-01), Musa et al.
patent: 6706831 (2004-03-01), Sonnenschein et al.
patent: 6762260 (2004-07-01), Sonnenschein et al.
patent: 6777512 (2004-08-01), Sonnenschein et al.
patent: 6791839 (2004-09-01), Bhagwagar
patent: 6806330 (2004-10-01), Sonnenschein et al.
patent: 6825298 (2004-11-01), Sonnenschein et al.
patent: 7247596 (2007-07-01), Jialanella et al.
patent: 2002/0028894 (2002-03-01), Sonnenschein et al.
patent: 2003/0064255 (2003-04-01), Dannenberg
patent: 2003/0064256 (2003-04-01), Sadvary et al.
patent: 2003/0175333 (2003-09-01), Shefer et al.
patent: 2003/0181611 (2003-09-01), Sonnenschein et al.
patent: 2003/0228973 (2003-12-01), Moren
patent: 2004/0210015 (2004-10-01), Sonnenschein et al.
patent: 2004/0220363 (2004-11-01), Sonnenschein
patent: 2004/0242812 (2004-12-01), Sonnenschein et al.
patent: 1 101 798 (2003-08-01), None
patent: 1156653 (1969-07-01), None
patent: WO 2004/020363 (2004-03-01), None
patent: WO 2005/017005 (2005-02-01), None
patent: WO 2005/017006 (2005-02-01), None
patent: WO 2005/044867 (2005-05-01), None
patent: WO 2006/07696 (2006-07-01), None
patent: WO 2006/073695 (2006-07-01), None
patent: WO 2006/088571 (2006-08-01), None
U.S. Appl. No. 60/815,049, filed Jun. 20, 2006, Ahn, Donchan, et al.
U.S. Appl. No. 60/719,296, filed Jun. 21, 2005, Ahn, Dongchan.
U.S. Appl. No. 60/879,459, filed Jan. 9, 2007, Ahn, Dongchan, et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Conductive curable compositions does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Conductive curable compositions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive curable compositions will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4168184

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.