Conductive core substrate fabrication

Details Conductive core substrate fabrication Conductive core substrate fabrication

2006-09-26

2006-09-26

Vinh, Lan (Department: 1765)

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating of groove or through hole

C216S019000, C438S129000, C438S667000

Reexamination Certificate

active

07112285

ABSTRACT:
Methods are provided for fabricating plated through hole conductive core substrate which eliminate the secondary step of producing a through hole in the dielectric material plugging the core through hole. In one embodiment of the method in accordance with the invention, a two-step lamination process is provided. One side of the conductive core is provided with a dielectric laminate, a portion of which flows into and coats the core through hole wall. Excess dielectric material flows out of the core through hole preventing plugging. Similarly, the other side of the conductive core is provided with a dielectric laminate, a portion of which flows into the core through hole completing the coating of the core through hole wall forming a dielectric liner. The dielectric liner insulates the conductive core through hole wall from a conductive layer deposited onto the dielectric liner forming a plated through hole.

REFERENCES:
patent: 5229550 (1993-07-01), Bindra et al.
patent: 5876842 (1999-03-01), Duffy et al.
patent: 6492201 (2002-12-01), Haba
patent: 6496356 (2002-12-01), Japp et al.

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