Conductive copper paste composition

Details Conductive copper paste composition Conductive copper paste composition

1987-03-24

1988-12-06

Rosenberg, Peter D.

Metal treatment

Compositions

Fluxing

148 25, B23K 3534

Patent

active

047894113

ABSTRACT:
A conductive copper paste composition is adapted to yield a highly conductive film receptive to solders without pretreatment. This conductive paste comprises a copper metal powder, a resin component including a thermosetting resin, and an assortment of additives. In use, the paste is applied to an insulation substrate to a predetermined circuit pattern and cured in situ. Soldering can then be performed directly on the cured circuit. This contributes not only to the conductivity of the circuit but dispenses with the activation treatment and electroless plating or electroplating that have heretofore been essential prior to soldering. The invention, therefore, results in a substantial curtailment of production process and a proportional economic advantage. In addition, this conductive paste can be used in such applications as electrode and through-hole connections, formation of electromagnetic and electrostatic shield layers, and so on in the manufacture and assembly of electronic components and circuits.

REFERENCES:
patent: 3453721 (1969-07-01), Jayne
patent: 3832242 (1974-08-01), Cuthbert
patent: 3986899 (1976-10-01), Kole
patent: 4151015 (1979-04-01), Cooper
patent: 4235649 (1980-11-01), Kaisha
patent: 4495007 (1985-01-01), Zado

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