Conductive copper paste

Details Conductive copper paste Conductive copper paste

1993-02-19

1994-08-09

Klemanski, Helene

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, 252512, 252518, 427123, 4273835, C09D 524, H01B 108

Patent

active

053363019

ABSTRACT:
A conductive copper paste contains copper powder and a glass frit of a zinc borosilicate system as a solid component dispersed in an organic vehicle. The content of said glass frit in the solid component falls in a range of 0.5 to 8 percent by weight. The paste is applied to ceramic green sheets and fired simultaneously with the ceramic green sheets to provide copper coatings on the ceramic sheets.

REFERENCES:
patent: 4865772 (1989-09-01), Suehiro et al.
patent: 4873022 (1989-10-01), Ogawa et al.
patent: 4906404 (1990-03-01), Suehiro et al.
patent: 4937016 (1990-06-01), Suehiro et al.
patent: 5035837 (1991-07-01), Saeki et al.
patent: 5066620 (1991-11-01), Sunahara et al.
patent: 5174925 (1992-12-01), Fujii et al.
patent: 5198154 (1993-03-01), Yokoyama et al.

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