Conductive container structures having a dielectric cap

Details Conductive container structures having a dielectric cap Conductive container structures having a dielectric cap

2005-09-20

2005-09-20

Trinh, Michael (Department: 2822)

Semiconductor device manufacturing: process

Making passive device

Trench capacitor

C438S398000, C438S396000, C438S253000

Reexamination Certificate

active

06946357

ABSTRACT:
Container structures for use in integrated circuits and methods of their manufacture. The container structures have a dielectric cap on the top of a conductive container to reduce the risk of container-to-container shorting by insulating against bridging of conductive debris across the tops of adjacent container structures. The container structures are adapted for use in memory cells and apparatus incorporating such memory cells, as well as other integrated circuits.

REFERENCES:
patent: 4093503 (1978-06-01), Harris et al.
patent: 4571817 (1986-02-01), Birritella et al.
patent: 4725560 (1988-02-01), Abernathey et al.
patent: 4783309 (1988-11-01), Popp et al.
patent: 4847214 (1989-07-01), Robb et al.
patent: 4848566 (1989-07-01), Havens et al.
patent: 5043780 (1991-08-01), Fazan et al.
patent: 5061650 (1991-10-01), Dennison et al.
patent: 5068199 (1991-11-01), Sandhu
patent: 5130885 (1992-07-01), Fazan et al.
patent: 5138412 (1992-08-01), Hieda et al.
patent: 5185282 (1993-02-01), Lee et al.
patent: 5191509 (1993-03-01), Wen
patent: 5192702 (1993-03-01), Tseng
patent: 5206183 (1993-04-01), Dennison
patent: 5244842 (1993-09-01), Cathey et al.
patent: 5266514 (1993-11-01), Tuan et al.
patent: 5278091 (1994-01-01), Fazan et al.
patent: 5284787 (1994-02-01), Ahn
patent: 5290729 (1994-03-01), Hayashide et al.
patent: 5340763 (1994-08-01), Dennison
patent: 5340765 (1994-08-01), Dennison et al.
patent: 5358908 (1994-10-01), Reinberg et al.
patent: 5364817 (1994-11-01), Lur et al.
patent: 5366917 (1994-11-01), Watanabe et al.
patent: 5381302 (1995-01-01), Sandhu et al.
patent: 5384152 (1995-01-01), Chu et al.
patent: 5392189 (1995-02-01), Fazan et al.
patent: 5405801 (1995-04-01), Han et al.
patent: 5407534 (1995-04-01), Thakur
patent: 5418180 (1995-05-01), Brown
patent: 5422294 (1995-06-01), Noble, Jr.
patent: 5444013 (1995-08-01), Akram et al.
patent: 5447878 (1995-09-01), Park et al.
patent: 5451537 (1995-09-01), Tseng et al.
patent: 5459094 (1995-10-01), Jun
patent: 5459344 (1995-10-01), Wakamiya et al.
patent: 5478772 (1995-12-01), Fazan
patent: 5480826 (1996-01-01), Sugahara et al.
patent: 5481127 (1996-01-01), Ogawa
patent: 5484740 (1996-01-01), Cho
patent: 5494841 (1996-02-01), Dennison et al.
patent: 5498562 (1996-03-01), Dennison et al.
patent: 5506166 (1996-04-01), Sandhu et al.
patent: 5543345 (1996-08-01), Liaw et al.
patent: 5554557 (1996-09-01), Koh
patent: 5597756 (1997-01-01), Fazan et al.
patent: 5604147 (1997-02-01), Fischer et al.
patent: 5608247 (1997-03-01), Brown
patent: 5629223 (1997-05-01), Thakur
patent: 5634974 (1997-06-01), Weimer et al.
patent: 5639689 (1997-06-01), Woo
patent: 5650351 (1997-07-01), Wu
patent: 5658381 (1997-08-01), Thakur et al.
patent: 5663090 (1997-09-01), Dennison et al.
patent: 5754390 (1998-05-01), Sandhu et al.
patent: 5759262 (1998-06-01), Weimer et al.
patent: 5770500 (1998-06-01), Batra et al.
patent: 5773341 (1998-06-01), Green et al.
patent: 5792689 (1998-08-01), Yang et al.
patent: 5795805 (1998-08-01), Wu et al.
patent: 5801413 (1998-09-01), Pan
patent: 5817555 (1998-10-01), Cho
patent: 5859760 (1999-01-01), Park et al.
patent: 5888877 (1999-03-01), Dennison et al.
patent: 5937294 (1999-08-01), Sandhu et al.
patent: 5940713 (1999-08-01), Green
patent: 5963804 (1999-10-01), Figura et al.
patent: 6018172 (2000-01-01), Hidaka et al.
patent: 6025246 (2000-02-01), Kim
patent: 6027970 (2000-02-01), Sharan et al.
patent: 6046083 (2000-04-01), Lin et al.
patent: 6077743 (2000-06-01), Chen
patent: 6140201 (2000-10-01), Jenq et al.
patent: 6146967 (2000-11-01), Thakur et al.
patent: 6150691 (2000-11-01), Clampitt
patent: 6177310 (2001-01-01), Lin et al.
patent: 6177340 (2001-01-01), Yoo et al.
patent: 6207523 (2001-03-01), Parekh et al.
patent: 6218288 (2001-04-01), Li et al.
patent: 6235639 (2001-05-01), Sandu et al.
patent: 6255687 (2001-07-01), Figura et al.
patent: 6258691 (2001-07-01), Kim
patent: 6281072 (2001-08-01), Li et al.
patent: 2003/0126356 (2003-07-01), Gustavson et al.
Kuhn, G.,et al., “Thin Silicon Film on Insulating Substrate”,Journal of the Electrochemical Society, 120(11), (1973),pp. 1563-1566.
Schnakenberg, U.,et al., “TMAHW Etchants for Silicon Micromachining”,Transducers—International Conference on Solid-State Sensors and Actuators—Digest of Technical Papers, (1991),pp. 815-818.
Mine, T., et al., “Capacitance-Enhanced Stacked-Capacitor with Engraved Storage Electrode for Deep Submicron DRAMs”,Extended Abstracts of the 21st Conference on Solid State Decives and Materials, Tokyo, pp. 137-140, (1989).
Watanabe, H., et al., “Hemispherical Grain Silicon for High Density DRAMs”,Solid State Technology, pp. 29-33, (Jul. 1992).

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