Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1996-05-17
1997-05-13
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257719, 257712, 257683, 257706, H01L 2316, H01L 2334, H01L 2310
Patent
active
056295626
ABSTRACT:
In a conductive contact structure for two conductors, a lower electrode also serves as a cooling element, and two grooves are formed in the lower surface of an electrode. A grease-like insulating material high in thermal conductivity is applied to the lower surface of the electrode except the middle region thereof which is defined by the two grooves; that is, it is applied only to the right and left regions of the lower surface which are located on both sides of the middle region. A pressurizing force is applied through an upper conductor to an electrode whose lower surface is fixed through an insulating board to the upper surface of the electrode. The middle region of the lower surface of the electrode is in contact with the surface of the lower conductor, and the right and left regions are elastically deformed in such a manner that they are slightly raised above the surface of the lower conductor, thus forming spaces therebetween. The spaces thus formed are filled with the insulating material. Thermal conduction; i.e., heat radiation is effected through the right and left regions to which the insulating material have been applied, and electrical conduction is ensured through the middle region to which the insulating material is not applied.
REFERENCES:
patent: 4092697 (1978-05-01), Spaight
patent: 4878108 (1989-10-01), Phelps et al.
patent: 5014777 (1991-05-01), Sano
patent: 5028989 (1991-07-01), Naganuma et al.
patent: 5345107 (1994-09-01), Daikoku et al.
Hisamoto Masaaki
Nomura Toshihiro
Clark Jhihan B.
Fuji Electric & Co., Ltd.
Saadat Mahshid D.
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