Conductive compositions used in the manufacture of...

Details Conductive compositions used in the manufacture of... Conductive compositions used in the manufacture of...

2005-04-14

2008-12-09

Kopec, Mark (Department: 1796)

Compositions

Electrically conductive or emissive compositions

Free metal containing

Reexamination Certificate

active

07462304

ABSTRACT:
The present invention is directed to a thick film conductive composition comprising: (a) electrically conductive silver powder; (b) Mn-containing additive; (c) glass frit wherein said glass frit has a softening point in the range of 300 to 600° C.; dispersed in (d) organic medium.The present invention is further directed to a semiconductor device and a method of manufacturing a semiconductor device from a structural element composed of a semiconductor having a p-n junction and an insulating film formed on a main surface of the semiconductor comprising the steps of (a) applying onto said insulating film the thick film composition as describe above; and (b) firing said semiconductor, insulating film and thick film composition to form an electrode.

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