Conductive compositions that are directly solderable and flexibl

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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Details

427282, 4273935, 4273936, 252514, 524440, 428901, B05D 512, H01B 102

Patent

active

045956049

ABSTRACT:
This invention provides conductive compositions that are solderable and flexible and that can be bonded directly to substrates. These compositions are made up of a combination of silver exclusively in the form of flake and resin system, said resin system comprising of vinyl chloride/vinyl acetate copolymer, epoxy resin and epoxy hardner. Also provided is a method of making these compositions. Another embodiment of this invention is a method of applying conductive compositions directly to substrates by bonding the conductive compositions directly to the substrate. Once cured, the compositions demonstrate good adhesion directly to the substrate in addition to excellent conductivity, solderability and flexibility characteristics.

REFERENCES:
patent: 3412043 (1968-11-01), Gilliland
patent: 4371459 (1983-02-01), Nazarenko
patent: 4410457 (1983-10-01), Fujimura et al.

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