Compositions – Electrically conductive or emissive compositions – Free metal containing
Reexamination Certificate
2011-05-03
2011-05-03
Kopec, Mark (Department: 1761)
Compositions
Electrically conductive or emissive compositions
Free metal containing
C427S096100, C136S252000
Reexamination Certificate
active
07935277
ABSTRACT:
The present invention is directed to a thick film conductive composition comprising: (a) electrically conductive silver powder; (b) zinc-containing additive; (c) glass frit wherein said glass frit is lead-free; dispersed in (d) organic medium. The present invention is further directed to an electrode formed from the composition above wherein said composition has been fired to remove the organic vehicle and sinter said glass particles. Still further, the invention is directed to a method of manufacturing a semiconductor device from a structural element composed of a semiconductor having a p-n junction and an insulating film formed on a main surface of the semiconductor comprising the steps of (a) applying onto said insulating film the thick film composition detailed above; and (b) firing said semiconductor, insulating film and thick film composition to form an electrode. Additionally, the present invention is directed to a semiconductor device formed by the method detailed above and a semiconductor device formed from the thick film conductive composition detailed above.
REFERENCES:
patent: 4051074 (1977-09-01), Asada
patent: 4256513 (1981-03-01), Yoshida et al.
patent: 4737197 (1988-04-01), Nagahara et al.
patent: 5645765 (1997-07-01), Asada et al.
patent: 7435361 (2008-10-01), Carroll et al.
patent: 7556748 (2009-07-01), Wang et al.
patent: 2002/0005507 (2002-01-01), Matsumoto
patent: 2004/0214016 (2004-10-01), Adachi
patent: 11-330512 (1999-11-01), None
patent: 2001-015782 (2001-01-01), None
patent: 2001-127317 (2001-05-01), None
patent: 2001-313400 (2001-11-01), None
patent: 2003-223813 (2003-08-01), None
patent: 2004-146521 (2004-05-01), None
Carroll Alan Frederick
Hang Kenneth Warren
E. I. Du Pont de Nemours and Company
Kopec Mark
LandOfFree
Conductive compositions and processes for use in the... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Conductive compositions and processes for use in the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive compositions and processes for use in the... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2631648