Compositions – Electrically conductive or emissive compositions – Free metal containing
Patent
1988-06-09
1991-02-26
Barr, Josephine
Compositions
Electrically conductive or emissive compositions
Free metal containing
252513, 252514, 523457, 523458, 523459, H01B 106
Patent
active
049960059
ABSTRACT:
A conductive composition comprising conductive particles made of a mechanical composite powder of copper or nickel covered with silver and a binder mainly containing bis-phenol A type epoxy resin (diglycidyl ether of bisphenol A) having 1600 to 5500 of molecular weight method for manufacturing a printed circuit substrate comprising the steps of printing the conductive composition on an insulating substrate and partially curing it in a range of 20 to 70% of completion as determined from DTA reactivity data. Thus, the conductive composition can manufacture an inexpensive circuit in simple steps as a whole with good solderability using low melting point solder and having high bonding strength. The method can manufacture the circuit by using the same conductive composition.
REFERENCES:
patent: 3194860 (1965-07-01), Ehneich et al.
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patent: 3547835 (1971-03-01), Voorhees et al.
patent: 3583930 (1980-12-01), Kawasumi et al.
patent: 4309457 (1982-01-01), Kawasumi et al.
patent: 4716081 (1987-12-01), Ehneich
Matsumora Satoru
Saito Mitsuru
Watanabe Yasushi
Alps Electric Co. ,Ltd.
Barr Josephine
Heid David W.
Shoup Guy W.
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