Compositions – Electrically conductive or emissive compositions – Free metal containing
Reexamination Certificate
2007-03-26
2010-06-22
Bos, Steven (Department: 1793)
Compositions
Electrically conductive or emissive compositions
Free metal containing
C252S515000, C252S519100, C252S519130, C252S520500, C252S521400
Reexamination Certificate
active
07740773
ABSTRACT:
The present invention provides a conductive composition and a conductive paste from which a conductive film having a high conductivity and a low thermal expansion coefficient can be formed.The thermal expansion coefficient of an island fixing type conductive layer10is compatible with that of a substrate12. A cracking of the island fixing type conductive layer10or a crack in the substrate12due to a difference between these thermal expansion coefficients is suitably inhibited. The thermal expansion coefficient of the island fixing type conductive layer10is adjusted by ZWP contained in the range from 10 to 55 (wt %) as a low-expansion filler. Thus, compared with the case where other low-expansion filler is added, the conductivity degradation is inhibited. Accordingly, the island fixing type conductive layer10having a high conductivity and a high bonding strength is obtained.
REFERENCES:
patent: 2004/0099847 (2004-05-01), Miura
patent: A 3-152837 (1991-06-01), None
patent: A 9-137066 (1997-05-01), None
patent: A 2001-312920 (2001-11-01), None
patent: A 2004-355880 (2004-12-01), None
patent: A 2005-035840 (2005-02-01), None
Iijima Motoki
Nakanishi Masayuki
Nishimura Tatsuro
Bos Steven
Darji Pritesh
Noritake Co., Limited
Noritake Itron Corporation
Oliff & Berridg,e PLC
LandOfFree
Conductive composition and conductive paste does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Conductive composition and conductive paste, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive composition and conductive paste will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4225132