Conductive clip for a semiconductor package

Equipment for production – distribution – or transformation of ene – Distribution – modification or control – Semiconductor – transistor or integrated circuit

Design Patent

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Design Patent

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D0503691

CLAIM:
The ornamental design for a conductive clip for a semiconductor package, as shown and described.

REFERENCES:
patent: 4864470 (1989-09-01), Nishio
patent: 5047833 (1991-09-01), Gould
patent: 5235496 (1993-08-01), Chomette et al.
patent: 5451544 (1995-09-01), Gould
patent: D379350 (1997-05-01), Kerklaan
patent: 5814884 (1998-09-01), Davis et al.
patent: 5818699 (1998-10-01), Fukuoka
patent: D407382 (1999-03-01), Acciaioli et al.
patent: 5904499 (1999-05-01), Pace
patent: 6107680 (2000-08-01), Hodges
patent: 6137158 (2000-10-01), Cohen et al.

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