Communications: radio wave antennas – Antennas – Microstrip
Reexamination Certificate
1999-02-16
2001-08-28
Wong, Don (Department: 2821)
Communications: radio wave antennas
Antennas
Microstrip
C343S895000, C029S600000, C428S042300
Reexamination Certificate
active
06281842
ABSTRACT:
TECHNICAL FIELD OF INVENTION
The present invention relates to a production method for, and a device for facilitating the production of, printed circuits for radio communication equipment. In general, and more particular to a production method for, and a device for facilitating production of, printed circuits disposed on a flexible carrier.
DESCRIPTION OF RELATED ART
The rapid expansion in the mobile telecommunication market and specifically in the radio communication market has led to a tremendous increase in the demand for radio communication devices. Thus the production of such devices increases. For a player on this market to stay competitive it is vital to have competitive products and a smooth manufacturing process for these products.
A specific, important, such product, in the radio communication area, is the antenna device. It is important for the antenna device to adhere to strict requirements of radio frequency characteristics, for instance electric length etc., in the particular radio frequency bands in which it is designed to be operative. These requirements in turn set requirements for the manufacturing process of these devices. For antenna devices designed with a conductive wire formed as a helix. The production might result in devices which vary somewhat in the aforementioned characteristics. These devices are, however, robust, low-cost and has proven to be, once tested to adhere to said requirements, a successful approach in the design of antenna devices for radio communication devices.
An antenna device designed as a conductive pattern on a flexible substrate has proven to be a design with very stable radio frequency characteristics. This is dependent on the accuracy with which it is possible to design the pattern on the flexible substrate. There is also a number of other advantages with using a flexible substrate. It can however be a problem to handle these thin flexible items in the manufacturing process. These problems might include that the items adhere to each other, that they hook in to slits in each other, difficulties in applying them to a coil neck (e.g. the antenna support), that they get stuck in fissures in the manufacturing machines etc. it would therefore be beneficial to have a manufacturing process to use the advantageous flexible substrates which do not have the above mentioned problems in the manufacturing.
SUMMARY OF INVENTION
One object of the present invention is thus to achieve a device for facilitating the manufacturing of devices comprising printed circuits on flexible substrates. This object is obtained by a device for feeding items to a manufacturing machine, where the device comprises a long flexible film arranged in a roll, the film comprising a first protective layer for carrying each of the items. An adhesive agent, applied between said item and the protective layer, attaching the item to the protective layer, the first protective layer and the agent cooperating so that when the item is detached from the first protective layer substantially all of the adhesive agent is disposed on said item and where the item comprises a printed circuit.
Another object of the present invention is to provide a method for manufacturing of a device which facilitate the manufacturing of devices comprising printed circuits on flexible substrates. This object is obtained by providing a method for manufacturing a roll of printed circuit diagrams wherein a long flexible first carrier having a conductive substrate and being arranged in a roll, is screen printed according to a first pattern with a screen paint; the part of the conductive substrate, not covered by the screen print, is etched away so that a printed circuit is obtained; the screen paint is washed away; a long flexible second carrier, comprising on a first side an adhesive agent, is laminated together with the first carrier, with the first side facing the first carrier; a first form is punched on the first carrier; excess material of the first carrier is removed so that a band is formed with the first carrier carrying items comprising said printed circuit having the first form.
Another object of the present invention is to provide a method for manufacturing an antenna device comprising at least one printed circuit on a flexible substrate, where said printed circuit comprises at least one radiating element.
An advantage with the present invention is that a smooth and efficient manufacturing process is achieved for the production of printed circuits on a flexible substrate.
An advantage, according to one embodiment of the invention, is that the above mentioned problems are avoided.
An advantage, according to one embodiment of the invention, is that each printed circuit item is well protected from damage and is fed in a controlled manner to a mounting machine.
An advantage, according to one embodiment of the invention, is that the orientation of the printed circuit items can be chosen to fit the specific application or mounting machine.
An advantage, according to one embodiment of the invention, is that it is easy to produce several different printed circuit layouts in one batch.
Further scope of applicability of the present invention will become apparent from the detailed description given hereinafter. However, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the invention, are given by way of illustration only, since various changes and modifications within the scope of the invention will become apparent to those skilled in the art from this detailed description.
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Allgon AB
Jacobson & Holman PLLC
Tran Thuy Vinh
Wong Don
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