Conductive bonding design for metal backed circuits

Details Conductive bonding design for metal backed circuits Conductive bonding design for metal backed circuits

1997-05-12

1999-07-06

Kincaid, Kristine

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

H05K 338

Patent

active

059200375

ABSTRACT:
The present invention provides a new device and technique for enhancing the electrical properties of the thick metal backer/adhesive bond/ground plane interface. The enhanced electrical properties are obtained by micro-roughening a connection surface of the thick metal backer prior to forming the thick metal backer/adhesive bond/ground plane interface.

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