Conductive block mounting process for electrical connection

Details Conductive block mounting process for electrical connection Conductive block mounting process for electrical connection

2007-06-26

2007-06-26

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

With vibration step

C257SE21506, C257SE21508

Reexamination Certificate

active

10927989

ABSTRACT:
A process for mounting conductive blocks on a surface of a substrate is disclosed wherein the substrate may be an IC chip, carrier, or a PCB. An adhesive layer is formed on each of the pads of the substrate. Thereafter, a plurality of conductive blocks are scattered on the surface of the substrate. The conductive blocks are vibrated such that only one of the conductive blocks is attached to the adhesive layer of each pad. After removing the un-attached conductive blocks from the surface of the substrate, and the remaining conductive blocks become the conductive blocks for electrical connection.

REFERENCES:
patent: 6268275 (2001-07-01), Cobbley et al.
patent: 6916687 (2005-07-01), Ho et al.
patent: 7045389 (2006-05-01), Tatsumi et al.

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