Conductive ball removing method, conductive ball mounting...

Details Conductive ball removing method, conductive ball mounting... Conductive ball removing method, conductive ball mounting...

2011-01-11

2011-01-11

King, Roy (Department: 1733)

Metal fusion bonding

Process

Combined

C228S246000, C228S041000

Reexamination Certificate

active

07866533

ABSTRACT:
In a method of removing conductive balls that are left on a mask provided on a substrate having pads thereon, the method includes: (a) making a sheet member close to the mask using a contacting mechanism such that a gap between the sheet member and the mask is set small than a diameter of the conductive balls. The conductive balls are removed in such a manner that the conductive balls are adhered onto the sheet member.

REFERENCES:
patent: 5431332 (1995-07-01), Kirby et al.
patent: 5466908 (1995-11-01), Hosoya et al.
patent: 5655704 (1997-08-01), Sakemi et al.
patent: 5918796 (1999-07-01), Matsuda et al.
patent: 5976269 (1999-11-01), Hamasaki et al.
patent: 6036787 (2000-03-01), Bennett et al.
patent: 2007/0052112 (2007-03-01), Bauer et al.
patent: 0962969 (1999-12-01), None
patent: 1603374 (2005-12-01), None
patent: 9-148332 (1997-06-01), None
patent: 2006-19741 (2006-01-01), None
patent: 2006-173195 (2006-06-01), None

Affiliated with

Also associated with

Rating

Conductive ball removing method, conductive ball mounting... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Conductive ball removing method, conductive ball mounting..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive ball removing method, conductive ball mounting... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2655424