Conductive ball mounting method, and apparatus therefor

Details Conductive ball mounting method, and apparatus therefor Conductive ball mounting method, and apparatus therefor

2006-03-29

2009-11-17

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Including applicator movable during fusion

Means to move applicator

C228S025000, C228S214000, C228S223000, C228S013000, C228S019000, C228S022000, C228S012000, C228S008000, C118S056000, C118S070000, C118S204000

Reexamination Certificate

active

07617962

ABSTRACT:
A conductive ball mounting apparatus and method for holding a conductive ball on the holding face, as has a suction port formed therein, of a holder head thereby to mount the held conductive ball, while interposing a flux therein, on a workpiece. After the end of the mounting action and before a next conductive ball is held, flux removing means for removing the flux adhered to the holding face is brought into abutment against the holding face of the holder head thereby to remove the flux from holding face.

REFERENCES:
patent: 5750199 (1998-05-01), Sakemi
patent: 6070783 (2000-06-01), Nakazato
patent: 6315185 (2001-11-01), Kajii
patent: 6575351 (2003-06-01), Kobayashi et al.
patent: 2001/0015372 (2001-08-01), Yamamoto et al.
patent: 2003/0213832 (2003-11-01), Kang et al.
patent: 11330123 (1999-11-01), None
patent: 2001-007136 (2001-01-01), None
Chinese Office Action dated Dec. 5, 2008.

Affiliated with

Also associated with

Rating

Conductive ball mounting method, and apparatus therefor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Conductive ball mounting method, and apparatus therefor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive ball mounting method, and apparatus therefor will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4099606