Metal fusion bonding – Including means to move or guide applicator
Reexamination Certificate
2011-03-08
2011-03-08
Ward, Jessica L (Department: 1735)
Metal fusion bonding
Including means to move or guide applicator
C228S043000, C228S033000, C228S180100, C228S180220, C438S612000, C438S613000
Reexamination Certificate
active
07900807
ABSTRACT:
In a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of pads which are provided on a substrate and on which an adhesive is formed, the conductive ball mounting apparatus includes: a conductive ball container for containing a plurality of conductive balls therein and having an opening to pass through the plurality of conductive balls; a substrate holder disposed over the conductive ball container to face the opening, and holding the substrate in such a manner that the plurality of conductive balls and the plurality of pads face each other and the substrate is disposed over the conductive ball container with a space therebetween; and a conductive ball supplying unit for supplying the plurality of conductive balls to the plurality of pads via the opening by moving up the plurality of conductive balls.
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Computer English Translation of JP 2002231751 A.
Higashi Mitsutoshi
Iida Kiyoaki
Kondo Norio
Sakaguchi Hideaki
Tanaka Kazuo
Drinker Biddle & Reath LLP
Saad Erin B
Shinko Electric Industries Co. Ltd.
Ward Jessica L
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