Metal fusion bonding – Process – Plural diverse bonding
Reexamination Certificate
2010-01-28
2011-12-13
Sample, David (Department: 1783)
Metal fusion bonding
Process
Plural diverse bonding
C228S179100, C228S180220, C228S245000
Reexamination Certificate
active
08074867
ABSTRACT:
A conductive ball mounting apparatus for mounting conductive balls by providing an array mask having through holes, into which conductive balls are to enter, above a mounting target placed on a stage, by arranging a ball reservoir having an opening for reserving a plurality of conductive balls, in the bottom, by moving the ball reservoir along the array mask, by dropping the conductive balls into the individual through holes of the array mask, adopts the following means. Firstly, the conductive ball mounting apparatus comprises moving means for moving the array mask and the stage relative to each other in horizontal directions. Secondly, the positions of the conductive balls in the through holes are arranged by finely moving at least one of the array mask and the stage relative to each other in the horizontal directions after the balls were dropped.
REFERENCES:
patent: 4893536 (1990-01-01), Kinoshita
patent: 5431332 (1995-07-01), Kirby et al.
patent: 5655704 (1997-08-01), Sakemi et al.
patent: 6253992 (2001-07-01), Fjelstad
patent: 6270002 (2001-08-01), Hayashi et al.
patent: 6402014 (2002-06-01), Inoue et al.
patent: 6533160 (2003-03-01), Bourrieres et al.
patent: 6595404 (2003-07-01), Suzuki et al.
patent: 2002/0058406 (2002-05-01), Mukuno et al.
patent: 2004/0134363 (2004-07-01), Saiki et al.
patent: 2005/0056682 (2005-03-01), Cobbley et al.
patent: 2798309 (2001-03-01), None
patent: 2425502 (2006-11-01), None
patent: 05-129374 (1993-05-01), None
patent: 11297886 (1999-10-01), None
patent: 3177370 (2001-04-01), None
patent: 2001358451 (2001-12-01), None
patent: 2002538970 (2002-11-01), None
patent: 2004-253770 (2004-09-01), None
Japanese Office Action dated Jan. 12, 2010 in Japanese Application No. 2005-132062.
Mehta Megha
Sample David
Shibuya Kogyo Co. Ltd.
Sughrue & Mion, PLLC
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