Conductive ball attaching apparatus and method

Details Conductive ball attaching apparatus and method Conductive ball attaching apparatus and method

1998-04-21

2000-06-06

Ryan, Patrick

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

228246, 228 565, 228245, 2282481, H05K 300

Patent

active

060707836

ABSTRACT:
An apparatus and a method for attaching conductive balls by which the tact time necessary for the positional recognition of a substrate before the conductive balls are attached onto a substrate can be greatly reduced. A first camera and a second camera are moved together a suction head. After the suction head picks up the conductive balls in a conductive ball supply section, the suction head is moved to a position above a flux supply section so that flux can be attached to the conductive balls 10, and concurrently the first camera recognizes a positional recognition mark on a substrate. Then, during when the suction head is moved to a position above the substrate, the second camera recognizes another positional recognition mark on the substrate. In accordance with the positional recognition conducted above, the suction head is positioned accurately with respect to the substrate, and then the conductive balls are attached onto the electrodes on the substrate.

REFERENCES:
patent: 4342090 (1982-07-01), Caccoma et al.
patent: 5601229 (1997-02-01), Nakazato et al.
patent: 5680984 (1997-10-01), Sakemi
patent: 5741410 (1998-04-01), Tsurushima
patent: 5788143 (1998-08-01), Boyd et al.
patent: 5867260 (1999-02-01), Sakai

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