Conductive adhesive useful for bonding a semiconductor die to a

Details Conductive adhesive useful for bonding a semiconductor die to a Conductive adhesive useful for bonding a semiconductor die to a

1989-11-29

1991-08-27

Barr, Josephine

Compositions

Electrically conductive or emissive compositions

Free metal containing

523428, 523429, 523434, 523457, 523459, 428413, 428416, 428414, 156330, 1563071, 1563073, H01B 106

Patent

active

050431021

ABSTRACT:
A conductive die attach composition containing no solvent and substantially no ionic impurities which comprises:

REFERENCES:
patent: 4410457 (1983-10-01), Fiyimura et al.
patent: 4975221 (1990-12-01), Chen
patent: 4994207 (1991-02-01), Edelman et al.

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