Conductive adhesive, method of producing the same, and...

Details Conductive adhesive, method of producing the same, and... Conductive adhesive, method of producing the same, and...

2008-04-15

2008-04-15

Douyon, Lorna M. (Department: 1796)

Compositions

Electrically conductive or emissive compositions

C428S357000, C428S375000, C428S671000, C428S674000, C427S216000

Reexamination Certificate

active

11500307

ABSTRACT:
A conductive adhesive is formed by mixing a plurality of conductive fillers into a thermosetting resin. The conductive filler includes a core material made of copper-based metal, a coating film made of silver and a plurality of particles made of silver. The coating film is provided on the core material to cover the core material, and the particles are provided on a surface of the coating film. Accordingly, a surface of the core material is prevented from being exposed. The conductive adhesive can be suitably used for bonding two members.

REFERENCES:
patent: 4606962 (1986-08-01), Reylek et al.
patent: 4652465 (1987-03-01), Koto et al.
patent: 4740657 (1988-04-01), Tsukagoshi et al.
patent: 5162087 (1992-11-01), Fukuzawa et al.
patent: 5213868 (1993-05-01), Liberty et al.
patent: 5604026 (1997-02-01), King
patent: 6223429 (2001-05-01), Kaneda et al.
patent: 6329101 (2001-12-01), Kawakami
patent: 6375866 (2002-04-01), Paneccasio et al.
patent: 6884833 (2005-04-01), Chheang et al.
patent: 7078095 (2006-07-01), Tam
patent: 2002/0004132 (2002-01-01), Banovetz et al.
patent: 2005/0034560 (2005-02-01), Kuwajima
patent: 2005/0182161 (2005-08-01), Khattar et al.
patent: 2006/0145125 (2006-07-01), Kuwajima et al.
patent: 2006/0145302 (2006-07-01), Kim et al.
patent: 0708582 (1996-04-01), None
patent: A-63-301408 (1988-12-01), None
patent: 06-136333 (1994-05-01), None
patent: 06-240464 (1994-08-01), None
patent: A-2000-192000 (2000-07-01), None
patent: A-2001-043729 (2001-02-01), None
patent: 2001-298049 (2001-10-01), None
patent: A-2003-068140 (2003-03-01), None
patent: A-2003-147316 (2003-05-01), None
patent: 2005-154861 (2005-06-01), None
Notice of Preliminary Rejection dated Jun. 21, 2007 issued in the corresponding Korean patent application No. 10-2006-0083728.

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