Conductive adhesive, method of producing the same, and...

Details Conductive adhesive, method of producing the same, and... Conductive adhesive, method of producing the same, and...

2008-04-15

2008-04-15

Douyon, Lorna M. (Department: 1796)

Compositions

Electrically conductive or emissive compositions

C428S357000, C428S375000, C428S671000, C428S674000, C427S216000

Reexamination Certificate

active

07357883

ABSTRACT:
A conductive adhesive is formed by mixing a plurality of conductive fillers into a thermosetting resin. The conductive filler includes a core material made of copper-based metal, a coating film made of silver and a plurality of particles made of silver. The coating film is provided on the core material to cover the core material, and the particles are provided on a surface of the coating film. Accordingly, a surface of the core material is prevented from being exposed. The conductive adhesive can be suitably used for bonding two members.

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Notice of Preliminary Rejection dated Jun. 21, 2007 issued in the corresponding Korean patent application No. 10-2006-0083728.

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