Conductive adhesive for providing electrical and thermal conduct

Details Conductive adhesive for providing electrical and thermal conduct Conductive adhesive for providing electrical and thermal conduct

1978-01-12

1979-04-03

Padgett, Benjamin R.

Compositions

Electrically conductive or emissive compositions

Free metal containing

252514, H01B 102

Patent

active

041476697

ABSTRACT:
An electrically and thermally conductive adhesive containing a metal alloy dispersed in a resin is disclosed. The composition of the adhesive may include a resin mixture and a gallium-metal alloy. The composition is very stable, is a liquid at room temperature and cures at a relatively low temperature with excellent adhesion and conduction properties and is resistant to relatively high temperatures.

REFERENCES:
patent: 3134671 (1964-05-01), Prosen
patent: 3475213 (1969-10-01), Stow
patent: 3554738 (1971-01-01), Beldham et al.
patent: 4015981 (1977-04-01), Rogova et al.
Journal of the American Dental Association, vol. 53, Dec. 1956, pp. 677-685, "Some Physical Properties of Ga-Cu-Sn alloys".
Journal of the American Dental Association, vol. 53, Sep., 1956, pp. 315-324, "Alloys of Gallium with Powdered Metals . . .".
Constitution of Binary Alloys, First Supplement, Rodney P. Elliott, Ph.D., McGraw-Hill Book Co., (New York), 1965, pp. 119, 458.

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