Conductive adhesive film techniques

Details Conductive adhesive film techniques Conductive adhesive film techniques

1991-07-24

1993-07-06

Picard, Leo P.

Electricity: electrical systems and devices

Miscellaneous

174259, 361400, 361405, 361408, 361412, 361414, 361411, H01R 909, H01R 458

Patent

active

052259668

ABSTRACT:
A compliant element (23, 25) is provided between an integrated circuit (11) and a substrate (19) which are bonded and interconnected by an anisotropic conductive adhesive (20) comprising conductive particles (21) in a polymer matrix (22). In one embodiment, one set of bonding pads (12, FIG. 2) is coated with a layer (23) of a metal that is significantly softer than the metal from which the conductive particles are made, which permits an oversized conductive particle (21a) to indent into the soft metal layer (23). In another embodiment, one of the sets of bonding pads (15, FIG. 3) is arranged on a relatively thick layer of adhesive (25) which is sufficiently viscous at the temperature at which contact is made to permit the bonding pad (15) to pivot in response to pressure from an oversized conductive particle (21d).

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