Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...
Reexamination Certificate
2008-03-18
2008-03-18
Niland, Patrick (Department: 1796)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
At least one aryl ring which is part of a fused or bridged...
C524S439000, C524S588000, C524S599000, C524S600000, C524S602000, C524S612000
Reexamination Certificate
active
10737748
ABSTRACT:
A conductive adhesive composition is obtained by mixing a binder resin with 30-98 wt % based on the adhesive composition of a silver powder as a conductive agent. The silver powder contains a silver powder consisting of flat primary particles and having a massive agglomerate structure and a tap density of 0.1-1.5 g/cm3in an amount of 30-98 wt % based on the adhesive composition. The conductive adhesive composition cures into a product having improved conductivity, adhesion, heat resistance, moisture resistance, ease of working and heat transfer.
REFERENCES:
patent: 4319920 (1982-03-01), Ehrreich
patent: 4435214 (1984-03-01), Ehrreich
patent: 4520422 (1985-05-01), Borland
patent: 4695404 (1987-09-01), Kwong
patent: 5162062 (1992-11-01), Carroll et al.
patent: 5180523 (1993-01-01), Durand et al.
patent: 5250229 (1993-10-01), Hara et al.
patent: 5298194 (1994-03-01), Carter et al.
patent: 5346651 (1994-09-01), Oprosky et al.
patent: 5492653 (1996-02-01), Hochheimer et al.
patent: 5658499 (1997-08-01), Steinberg et al.
patent: 2002/0022152 (2002-02-01), Okinaka et al.
patent: 2004/0203268 (2004-10-01), Nishizawa
patent: 7-169325 (1995-07-01), None
patent: 9-82133 (1997-03-01), None
patent: 9-296158 (1997-11-01), None
patent: 11-158501 (1999-06-01), None
patent: 2000-256008 (2000-09-01), None
patent: 2001-107101 (2001-03-01), None
patent: 2003-268402 (2003-09-01), None
Abstract and Machine Translation for JP 2003-268402 (p. 1-13) and JP 09-296158 (p. 1-4).
Abstract for JP 06-235006.
Machine Translations for JP 2001-107101 (p. 1-10); JP 11-158501 (p.1-4); JP 09-082133 (p. 1-5).
Abstract for KR 2002-080822.
Schaefer et al. Conductive Adhesives With Improved Thermomechanical Properties. IEEE. 1998, p. 278-281.
Fukushima Motoo
Shiobara Toshio
Yoshino Masachika
Birch & Stewart Kolasch & Birch, LLP
Niland Patrick
Shin-Etsu Chemical Co. , Ltd.
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